Multi-layer materials can be laminated at the same time

Suitable for a variety of substrates, including double-sided tape, foam, insulating materials, mesh materials, functional films, metal foils, etc.

High-complex processing ability: Die-cutting, punching, embossing, and waste removal can be performed on different layers of substrates, and then paste into products with high die-cutting accuracy

High die-cutting accuracy

● 可同時貼合多層材料

● 適用多種基材，包含雙面膠、泡棉、絕緣材料、網紗材料、功能性薄膜、金屬箔等

● 高複雜加工能力：可對不同層的基材進行模切、打洞、壓凸、排廢等加工，再貼合成高模切精度的產品

● 高模切精度

Mobile phones, consumer electronics, car parts or medical equipment

手機、消費性電子產品、車用零配件或醫療設備

According to customer needs size  stamping or cutting. 可按客戶需求尺寸沖型或裁切。