LBD-GPP500系列熱傳導界面材料是填充發熱器件和散熱片或金屬底座之間的空氣間隙,它們的柔性、彈性特征使其能夠用於覆蓋非常不平整的表面。熱量從分離器件或整個PCB傳導到金屬外殼或擴散板上,從而能提高發熱電子組件的效率和使用壽命。
LBD-GPP500 Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
LBD-GPP500系列熱傳導界面材料是填充發熱器件和散熱片或金屬底座之間的空氣間隙,它們的柔性、彈性特征使其能夠用於覆蓋非常不平整的表面。熱量從分離器件或整個PCB傳導到金屬外殼或擴散板上,從而能提高發熱電子組件的效率和使用壽命。
● Power Supplies 電源模塊
● Automotive control services 汽車控制服務
● Military Electronics 軍用電子
● LED Lighting, LCD-TV LED照明設備,平面顯示器
● Telecom services, Wireless instruments 電信服務,無線儀器
● Computer services: CPU, Heat sink, Memory modules 計算機服務:CPU,散熱器,記憶存儲模塊
● Standard size 標準尺寸: 200mm×400mm 、300mm×400mm
● Custom Die-cut shapes 不同形狀冲型裁切
● 0.3~10mm thickness optional 0.3~10mm厚度可選
● With or without adhesive 可依需求背膠
Property 特性 | LBD-GPP500 | Unit | Tolerance | Test Method |
Composition 主要成份 | Filled silicone elastomer 填充硅胶 | — | — | — |
Color 顏色 | Purple(紫色) | — | — | Visual |
Thermal Conductive 導熱率 | 5.0 | W/m.K | ±10% | ASTM D5470 |
Thickness 厚度範圍 | 12~400(1mil=0.0254mm) | mil | ±10% | ASTM D374 |
0.5~10 | mm 毫米 | |||
Hardness 硬度 | 60 | Shore 00 | — | ASTM D2240 |
Density 密度 | 3.1 | g/cm³ | — | ASTM D792 |
Temperature Range 操作溫度 |
-40~+200 |
℃ | — | — |
Breakdown Voltage 耐電壓值 | >3000(0.3mm~0.5mm) | V | — | ASTM D149 |
>5000(>0.5mm) | ||||
Flame Rating 阻燃等級 | UL 94 V-0 | — | — | UL 94 |
Dielectric Constant 電介常數 | 12.6 | MHz | — | ASTM D150 |
Standard Sheet Size 標準片材尺寸 | 200*400 / 300*400 | mm | — | — |
Volume Resistivity 體積阻抗 | 1013 | Ω.cm | — | ASTM D257 |
例如:LBD- GPP500-30-C
說明:
● LBD代表:萊必德品牌
● GPP500代表:導熱係數5.0W/m.k
● 30代表:厚度0.3mm,可生產厚度範圍为0.3~10mm
● C代表:添加石墨烯