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石墨烯新材料
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莱必德科技
导热凝胶

导热凝胶

高導熱凝膠LBD-GPN500,俗稱導熱膠泥或導熱黏土,針筒包裝、可自動化點膠、耐高溫、不腐蝕金屬、100%熟化導熱凝膠。LBD-GPN500是一種高性能導熱凝膠,它以矽膠為基體,填充以多種高性能陶瓷粉末制成,高導熱凝膠具有導熱系數高、熱阻低、在散熱部件上帖服性良好、絕緣、可自動填補空隙,最大限度的增加有限接觸面積,可以無限壓縮的特點。

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  • High thermal conductivity gel LBD-GPN500, commonly known as thermally conductive cement or thermally conductive clay, is packaged in syringes, can be automatically dispensed, is resistant to high temperatures, does not corrode metals, and is 100% cured thermally conductive gel. LBD-GPN500 is a high-performance thermal conductive gel. It uses silica gel as the matrix and is filled with a variety of high-performance ceramic powders. The high thermal conductive gel has high thermal conductivity, low thermal resistance, and good adherence to heat dissipation components. , Insulation, can automatically fill gaps, maximize the limited contact area, and can be compressed infinitely.

    高導熱凝膠LBD-GPN500,俗稱導熱膠泥或導熱黏土,針筒包裝、可自動化點膠、耐高溫、不腐蝕金屬、100%熟化導熱凝膠。LBD-GPN500是一種高性能導熱凝膠,它以矽膠為基體,填充以多種高性能陶瓷粉末制成,高導熱凝膠具有導熱系數高、熱阻低、在散熱部件上帖服性良好、絕緣、可自動填補空隙,最大限度的增加有限接觸面積,可以無限壓縮的特點。

  • Good thermal conductivity (3~8W/M.K), low thermal resistance 良好導熱率(3~8W/M.K),低熱阻

    High electrical insulation performance 高電氣絕緣性能

    Compression force application; low stress, high compression ratio 壓縮力應用;低應力,有高壓縮比

    Good temperature resistance, can be used automatically 良好的耐溫性能,可實現自動化使用

    Suitable for screen printing and other processes 適用於絲網印刷等工藝

  • Mainly used in UAV UAV, automobile industry and communication industry and other fields.

    主要應用於UAV無人機、汽車產業及通訊行業等領域。

  • Can be customized according to customer needs 可按客戶需求定制
  • 规格 单位 LBD-GPN500 Method
    颜色 Color
     
    白 色 White visual
    挤出速度Flow Rate (30cc EFD cartridges
    0.100”orifice 90psi)
    g/min 6
     
    比重 Specific Gravity g/cm³ 3.3 ASTM D792
    体积电阻 Volume Resistivity Ω.cm >1013 ASTM D257
    导热系数 Thermal Conductivity W/mK 5.0 HOT DISK
    击穿电压 Breakdown Voltage KV/mm 10 ASTM D149
    介电常数 Dielectric Constant 1 8.0 ASTM D150
    最小界面厚度 BLT Thickness mm 0.08 ASTM D374
    使用温度 Application temperature -50~200
     
    存放时间 shelf life month 12
     
    硅氧烷挥发 Siloxane Volatiles D4~D20 % <0.01 GC-FID
    热膨胀系数 Coefficient of Thermal
    Expansion,
    ppm/K 140
     
    阻燃性 Flammability UL94 V-0 Equivalent UL94
     

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