高導熱凝膠LBD-GPN500,俗稱導熱膠泥或導熱黏土,針筒包裝、可自動化點膠、耐高溫、不腐蝕金屬、100%熟化導熱凝膠。LBD-GPN500是一種高性能導熱凝膠,它以矽膠為基體,填充以多種高性能陶瓷粉末制成,高導熱凝膠具有導熱系數高、熱阻低、在散熱部件上帖服性良好、絕緣、可自動填補空隙,最大限度的增加有限接觸面積,可以無限壓縮的特點。
High thermal conductivity gel LBD-GPN500, commonly known as thermally conductive cement or thermally conductive clay, is packaged in syringes, can be automatically dispensed, is resistant to high temperatures, does not corrode metals, and is 100% cured thermally conductive gel. LBD-GPN500 is a high-performance thermal conductive gel. It uses silica gel as the matrix and is filled with a variety of high-performance ceramic powders. The high thermal conductive gel has high thermal conductivity, low thermal resistance, and good adherence to heat dissipation components. , Insulation, can automatically fill gaps, maximize the limited contact area, and can be compressed infinitely.
高導熱凝膠LBD-GPN500,俗稱導熱膠泥或導熱黏土,針筒包裝、可自動化點膠、耐高溫、不腐蝕金屬、100%熟化導熱凝膠。LBD-GPN500是一種高性能導熱凝膠,它以矽膠為基體,填充以多種高性能陶瓷粉末制成,高導熱凝膠具有導熱系數高、熱阻低、在散熱部件上帖服性良好、絕緣、可自動填補空隙,最大限度的增加有限接觸面積,可以無限壓縮的特點。
Good thermal conductivity (3~8W/M.K), low thermal resistance 良好導熱率(3~8W/M.K),低熱阻
High electrical insulation performance 高電氣絕緣性能
Compression force application; low stress, high compression ratio 壓縮力應用;低應力,有高壓縮比
Good temperature resistance, can be used automatically 良好的耐溫性能,可實現自動化使用
Suitable for screen printing and other processes 適用於絲網印刷等工藝
Mainly used in UAV UAV, automobile industry and communication industry and other fields.
主要應用於UAV無人機、汽車產業及通訊行業等領域。
规格 | 单位 | LBD-GPN500 | Method |
颜色 Color |
|
白 色 White | visual |
挤出速度Flow Rate (30cc EFD cartridges 0.100”orifice 90psi) |
g/min | 6 |
|
比重 Specific Gravity | g/cm³ | 3.3 | ASTM D792 |
体积电阻 Volume Resistivity | Ω.cm | >1013 | ASTM D257 |
导热系数 Thermal Conductivity | W/mK | 5.0 | HOT DISK |
击穿电压 Breakdown Voltage | KV/mm | 10 | ASTM D149 |
介电常数 Dielectric Constant | 1 | 8.0 | ASTM D150 |
最小界面厚度 BLT Thickness | mm | 0.08 | ASTM D374 |
使用温度 Application temperature | ℃ | -50~200 |
|
存放时间 shelf life | month | 12 |
|
硅氧烷挥发 Siloxane Volatiles D4~D20 | % | <0.01 | GC-FID |
热膨胀系数 Coefficient of Thermal Expansion, |
ppm/K | 140 |
|
阻燃性 Flammability | UL94 | V-0 Equivalent |
UL94 |