環氧導熱膠,具有結構功能膠的特性.固化物有很強的粘接強度,同時具有良好的導熱性、抗壓,抗彎曲,低收縮,低吸潮性高等物理特性.本產品具有導熱效果,粘接性好,對鋁,銅,不鏽鋼,聚碳酸酯(PC)等多種材料都具有較好的粘接性,介電性能優越,耐熱性能好,使用溫度范圍-40℃～180℃，符合歐盟 RoHS、REACH 指令要求
Epoxy thermal conductive adhesive has the characteristics of structural functional adhesive. The cured product has strong bonding strength, and at the same time has good thermal conductivity, compression resistance, bending resistance, low shrinkage, low moisture absorption and high physical characteristics. This product has thermal conductivity Effect, good adhesion, good adhesion to various materials such as aluminum, copper, stainless steel, polycarbonate (PC), superior dielectric properties, good heat resistance, operating temperature range -40℃～ 180℃, in line with EU RoHS and REACH directive requirements
環氧導熱膠,具有結構功能膠的特性.固化物有很強的粘接強度,同時具有良好的導熱性、抗壓,抗彎曲,低收縮,低吸潮性高等物理特性.本產品具有導熱效果,粘接性好,對鋁,銅,不鏽鋼,聚碳酸酯(PC)等多種材料都具有較好的粘接性,介電性能優越,耐熱性能好,使用溫度范圍-40℃～180℃，符合歐盟 RoHS、REACH 指令要求
1. Component epoxy thermal conductive adhesive
2. Fast curing by heat, heating at 150°C for 15-20min
3. Good connection strength, up to 22Mpa or more
4. Thermal coefficient 2.45W/mk
1、組分環氧導熱膠
2、熱快速固化, 150度加溫15-20min
3、接強度佳，可達22Mpa以上
4、熱系數 2.45W/mk
1. It belongs to alloy, plastic, magnet, special material structure bonding, etc.
2. Control computer, lithium battery, new energy and other products.
1、屬合金,塑料,磁鐵,特種材料結構粘接等
2、控計算機,鋰電池,新型能源等產品.
According to customer needs size stamping or cutting. 可按客戶需求定制。
產品性能
|
Performance 性能指標 |
parameter 參數 |
|
|
A |
B |
|
|
Viscosity 粘度（25℃） cps |
6000（可調整） |
100 |
|
proportion 比重 g/cm3 |
1.80 |
1..05 |
|
Mixing ratio (weight ratio) 混合比例（重量比） |
A：B = 100：20 |
|
|
Operational time 可操作時間 |
90克/40-60分鍾（可調整） |
|
|
Curing condition 固化條件 |
25℃/24小時 或 60℃/2小時 |
|
|
Performance 性能指標 |
parameter 參數 |
|
Volume resistivity 體積電阻系數，Ω·cm |
≥2.2×1014 |
|
Volume resistivity 表面電阻系數，Ω |
≥5.0×1014 |
|
Breakdown voltage 擊穿電壓，KV/mm |
≥20 |
|
Dielectric constant 介電常數 |
4.5 |
|
Dielectric loss 介電損耗 |
0.029(1MHz) 0.060(60Hz) |
|
Shore hardness 邵爾硬度 |
D90 |
|
Compressive strength 壓縮強度 MPa |
75 |
|
Curing shrinkage 固化收縮率 |
0.6% |
|
Thermal Conductivity 導熱系數，W/m.K |
0.55 |
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